Lead Frame Chemical

Lead Frame Chemical

Product Name Usage Copper Alloy Ag Plating 42Alloy Ag plating PPF Feature
PD-450 Silver Anti-Immersion   Organic +Silver layer
KS-1000R Silver stripping   Electrolytic type, Long life
KS-Add2 Additive for Silver stripping   Improvement of the performance of KS-1000R
CS-1 Copper stripping     Dipping type, Bath stability, Anti-turn over for Ag plating
HK-2000 Anti-tarnish for copper     High anti-tarnish, Water-repellent
AT-2 (+PSC) Anti-CPO(Copper oxide Peeling Off)     High heat resistance, Anti-CPO(PSC type)
AT-4 Anti-CPO(Copper oxide Peeling Off)     High heat resistance, Anti-CPO(Non PSC type)
OA-2 Multifunctional anti-tarnish for copper     Anti-CPO + adhesion promoting for resin
IS-1 Multifunctional anti-tarnish for copper     Anti-CPO + adhesion promoting for resin
PA-2 Adhesion promoting for metal   Silane coupling agent, adhesion promoting between various metals and resin
BA-1,BA-2 Anti-EBO(Epoxy Bleed Out)   Selective adsorption on silver, Non-fluorine, Non-sulfur
BA-7R Anti-EBO(Epoxy Bleed Out) Adsorption on all metals, Fluorine-type, Low bubble
BA-9H Anti-EBO(Epoxy Bleed Out) Adsorption on all metals, Non-Fluorine, Non-sulfur
BA-10 Anti-EBO(Epoxy Bleed Out) Adsorption on all metals, Non-Fluorine, Non-sulfur, Low bubble
TG-4R Anti-EBO(Epoxy Bleed Out) Adsorption on all metals, low conc. usage, high Water-repellent
P・Pd-2 Electro-Palladium plating     High-throwing power, High-solderability

Spot silver plating process

Spot silver plating process

PPF plating process

PPF plating process

Plating thickness  Cu:~0.1μm、Ag:~5μm、Ni:~2μm、Pd:~0.03μm、Au:~0.01μm