Product Name | Usage | Feature |
---|---|---|
KG-510 | Alkali cleaner | Effective to remove adhesive of FPC and resist residue of PWB. |
KG-511 | Acid cleaner | Effective to remove adhesive of FPC and resist residue of PWB. |
KG-512 | Acid cleaner | Acid cleaner with little damage to resist. |
KG-528 | Activator | Sulfuric acid type, low conc. of Pd |
KG-529 | Activator(Hydrochloric acid) | Low conc. of HCl type, for fine patterns and long bath life |
KG-529PLUS | Activator | Low Pd, low conc. of HCl type, for fine patterns and long bath life |
KG-531 | Soft Electroless Nickel (Flexible board) | Phosphorous : 6~8% (Middle P type) Excellent for anti-crack property. |
KG-535 | Electroless Nickel (Rigid board) | Phosphorous : 8~10% (Middle-high P type) Excellent for anti-corrosion property. |
KG-536 | Soft Electroless Nickel (Flexible board) | Phosphorous : 8~10% (Middle-high P type) Excellent for anti-crack property. |
KG-537 | Soft Electroless Nickel (Flexible board) | Phosphorous : 6~8% (Middle P type) Pb free, excellent for anti-crack property. |
KG-538 | Soft Electroless Nickel (Flexible board) | Phosphorous : 8~10% (Middle-high P type) Excellent for anti-crack property. Good resistance with artifitial sweat test. |
KG-110N | Thin Electroless Palladium | Immersion type Excellent for bath stability |
KG-110NSJ | Thin Electroless Palladium | Electroless type (Alloy Pd-P) Excellent for bath stability |
KG-116 | Electroless pure Pd | Electroless type, pure Pd layer |
KG-545 | Thin Immersion Gold | Immersion type Fast in deposition speed and easy to control |
KG-545Y | Thin Immersion Gold | Immersion type Less corrosion on Ni and easy to control |
Product Name | Usage | Feature |
---|---|---|
KG-210 | Post treatment for Pd and Au surface | Water soluble, Anti-oxidation by creating heat resistant film |
KG-230 | Sealing agent for Au(/Ni) surface | Water soluble, high resistance for pin-hole corrosion |
TG-3M | Antioxdation for Sn and Sn alloy | Anti-oxidation at high temperature strong acidic, non bubble |
OP-1 | Anti-tarnish for PWB | Anti-tarnish for storage purpose |
OP-10 | Anti-tarnish for PWB (FPC) | Anti-tarnish at high temperature |
OP-11 | Anti-tarnish for PWB, Phousphorous free | Copper heat resistance and anti-tarnish agent, suitable for high temperature and copper anti-oxidation Applicable for phosphorous restriction in waste water |
CR-1 | Anti-tarnish for PWB | Anti-tarnish for storage purpose Removal of oxidized copper layer and having anti-tarnish effect |