Electroless-Plating Solution for PWB/FPC

Electroless-plating chemical for PWB/FPC

Product Name Usage Feature
KG-510 Alkali cleaner Effective to remove adhesive of FPC and resist residue of PWB.
KG-511 Acid cleaner Effective to remove adhesive of FPC and resist residue of PWB.
KG-512 Acid cleaner Acid cleaner with little damage to resist.
KG-528 Activator Sulfuric acid type, low conc. of Pd
KG-529 Activator(Hydrochloric acid) Low conc. of HCl type, for fine patterns and long bath life
KG-529PLUS Activator Low Pd, low conc. of HCl type, for fine patterns and long bath life
KG-531 Soft Electroless Nickel (Flexible board) Phosphorous : 6~8% (Middle P type)
Excellent for anti-crack property.
KG-535 Electroless Nickel (Rigid board) Phosphorous : 8~10% (Middle-high P type)
Excellent for anti-corrosion property.
KG-536 Soft Electroless Nickel (Flexible board) Phosphorous : 8~10% (Middle-high P type)
Excellent for anti-crack property.
KG-537 Soft Electroless Nickel (Flexible board) Phosphorous : 6~8% (Middle P type)
Pb free, excellent for anti-crack property.
KG-538 Soft Electroless Nickel (Flexible board) Phosphorous : 8~10% (Middle-high P type)
Excellent for anti-crack property.
Good resistance with artifitial sweat test.
KG-110N Thin Electroless Palladium Immersion type
Excellent for bath stability
KG-110NSJ Thin Electroless Palladium Electroless type (Alloy Pd-P)
Excellent for bath stability
KG-116 Electroless pure Pd Electroless type, pure Pd layer
KG-545 Thin Immersion Gold Immersion type
Fast in deposition speed and easy to control
KG-545Y Thin Immersion Gold Immersion type
Less corrosion on Ni and easy to control

Post Treatment for PWB

Product Name Usage Feature
KG-210 Post treatment for Pd and Au surface Water soluble, Anti-oxidation by creating heat resistant film
KG-230 Sealing agent for Au(/Ni) surface Water soluble, high resistance for pin-hole corrosion
TG-3M Antioxdation for Sn and Sn alloy Anti-oxidation at high temperature
strong acidic, non bubble
OP-1 Anti-tarnish for PWB Anti-tarnish for storage purpose
OP-10 Anti-tarnish for PWB (FPC) Anti-tarnish at high temperature
OP-11 Anti-tarnish for PWB, Phousphorous free Copper heat resistance and anti-tarnish agent, suitable for high
temperature and copper anti-oxidation
Applicable for phosphorous restriction in waste water
CR-1 Anti-tarnish for PWB Anti-tarnish for storage purpose
Removal of oxidized copper layer and having anti-tarnish effect

ElectrolessPlating:KG Process

ElectrolessPlating:KG Process