Product | Main Use | Concentration | Feature |
---|---|---|---|
CT-3 | Seal treatment forAu(/Ni) Anti-tarnish for Ag(plating) |
50ml/L | standard High corrosion resistance for Au (salt spray) , high water repellency, Sulfur resistance for Ag |
CT-3xA | Sealing agent of Au(/Ni)electro-type | 100ml/L | Short dipping time(1~5s), Applicable for Reel to Reel treatment, Anode electrolyze |
PT-4 | Sealing agent of Au(/Ni)electro-type | 100ml/L | High corrosion resistance, Applicable for Reel to Reel treatment, Good resistance on salt spray, Anode electrolyze |
CT-3u | Anti-tarnish for Ag(plating) | 100ml/L | Better sulfer resisitance than CT-3 Cathode electrolyze |
CT-88S | Seal treatment for Au(/Ni) Sn | 40ml/L | Both Au(/Ni) and Sn plating are treated together. Thick treatment layer. Without rinsing after treatment. |
TG-3 | Anti-oxidation for Sn(alloy) | 50-100ml/L | Strong acid type, high heat resistance |
TG-4 | Anti-oxidation for Sn(alloy) | 50-100ml/L | Strong acidity Anti-oxidation at high temperature and humidity |
TG-6 | Anti-oxidation for Sn(alloy) | 100ml/L | Weak acidity Suitable for low acidic resistance parts |
TG-6P | Anti-oxiation for Sn(Sn alloy phophorous free) | 100ml/L | Weak acidity, Suitable for low acidic resistance parts Applicable for phosphorous restriction in waste water |
Product | Main Use | Concentration | Feature |
---|---|---|---|
CT-5tfx | Anti-tarnish for Ag plating | 50ml/L | high heat resistance, good bondability Anti-tarnish to sulfuration gas |
CT-6 | Anti-tarnish for Ag plating | 50ml/L | high heat resistance, good bondability Anti-tarnish to sulfuration gas |
TG-5S | Anti-RBO for Ag plating | 10ml/L | Good anti-RBO effect good bondability |
LA-1 | Adhesion promotor between Ag plating and silicone resin | 50ml/L | Silane-coupling agent is our original material The adhesion strength is 2 to 3 times higher than no-treated. No influence to reflectance, wire bondability and glossiness |
RCA-1 | Ag recrystallization inhibitor | 10ml/L | Control of Ag recrystallization and glossiness change by heating |
Product | Main Use | Concentration | Feature |
---|---|---|---|
KI-200 | Cu anti-tarnish (2 solutions) | every 5ml/L | High humidity resistace, for copper and copper alloy surface. |
Product | Main Use | Feature |
---|---|---|
IM-1000 | Add to resin product or surface treatment, for adhesion improvement | Solvent soluble |
IS-1000 | Add to resin product or surface treatment, for adhesion improvement | Water and alcohol soluble |