☞ Stable Pd deposition rate (Non decline)
☞ Excellent solution stability
※ MTO (Metal Turn Over):Pd metal consumption by deposition
Ex) Pd concentration : 0.5g/L ⇒ 1MTO
Before soldering,
Heat aging treatment ⇒ reflow 4 times
Solder ball :Sn-2Ag-Cu-Ni
Ball diameter :Φ0.4mm
Pad diameter :Φ0.35mm BGA
Flux :30% Rosin (R type)
Equipment :Dage-4000HS
Shear speed :1000mm/s
Shear height :100μm