Electroless-Plating Process (Ni/Pd/Au)
Electroless (thick) Pd Type

Deposition rate is very stable.

☞ Stable Pd deposition rate (Non decline)
☞ Excellent solution stability

※ MTO (Metal Turn Over)：Pd metal consumption by deposition
　　　　　　　　　　 　Ex) Pd concentration ： 0.5g/L ⇒ 1MTO

Excellent of Solderability & Wire Bondability.

Before soldering,
Heat aging treatment ⇒ reflow 4 times
Solder ball　　：Sn-2Ag-Cu-Ni
Ball diameter　：Φ0.4mm
Pad diameter　：Φ0.35mm BGA
Flux 　　　　　：30% Rosin (R type)
Equipment　　：Dage-4000HS
Shear speed 　：1000mm/s
Shear height ：100μm