Electroless-Plating Process (Ni/Pd/Au)
Electroless (thick) Pd Type

ENIPIG Process

Main characteristics

Deposition rate is very stable.

Relative deposition rate

☞ Stable Pd deposition rate (Non decline)
☞ Excellent solution stability

MTO (Metal Turn Over):Pd metal consumption by deposition
            Ex) Pd concentration : 0.5g/L ⇒ 1MTO

Excellent of Solderability & Wire Bondability.

Relative deposition rate

Solderability

Before soldering,
Heat aging treatment ⇒ reflow 4 times
Solder ball  :Sn-2Ag-Cu-Ni
Ball diameter :Φ0.4mm
Pad diameter :Φ0.35mm BGA
Flux      :30% Rosin (R type)
Equipment  :Dage-4000HS
Shear speed  :1000mm/s
Shear height :100μm

Solderability

Wire bondability

Wire bondability
Wire bondability
Wire bondability

Main uses

  • Substrate for IC package
  • Substrate for LED
  • PWB