Electroless-Plating Process (Ni/Pd/Au)
Immersion (Flash) Pd Type

ENEPIG Process

Main characteristics

Compared with conventional ENEPIG process, Pd & Au film thicknesses are very thin.

Electroless-Plating Process (Ni/Pd/Au) Immersion (Flash) Pd Type

Deposition rate is very stable.

Relative deposition rate

☞ Stable Pd deposition rate (Non decline)
☞ Excellent solution stability

MTO (Metal Turn Over):Pd metal consumption by deposition
            Ex) Pd concentration : 0.5g/L ⇒ 1MTO

Deposition rate is very stable

Characteristic of solderability & Wire Bondability are equal to conventional Ni/Au or Ni/Pd/Au process.

Electroless-Plating Process (Ni/Pd/Au) Immersion (Flash) Pd Type
Electroless-Plating Process (Ni/Pd/Au) Immersion (Flash) Pd Type
Electroless-Plating Process (Ni/Pd/Au) Immersion (Flash) Pd Type
Electroless-Plating Process (Ni/Pd/Au) Immersion (Flash) Pd Type

Main uses

  • Substrate for IC package
  • Substrate for LED
  • PWB