High Heat Resistance Anti-tarnish Solution

Copper anti-tarnish solution(AT-4)

Tape peeling test of Copper oxide

  280℃ 300℃ 320℃ 340℃ 360℃ 380℃ 400℃
No-treated

No-treated 280℃

No-treated 300℃

No-treated 320℃

No-treated 340℃

No-treated 360℃

No-treated 380℃

No-treated 400℃

Area ratio of peeling off (%) 0 0 10 20 50 90 100
AT-4

AT-4 280℃

AT-4 300℃

AT-4 320℃

AT-4 340℃

AT-4 360℃

AT-4 380℃

AT-4 400℃

Area ratio of peeling off (%) 0 0 0 0 0 1 5

Copper material: C194 + Copper strike plating (0.2μm)

Test method of tape peeling

  1. For 5 minutes at 280~400℃(on hot-plate)
  2. Peeling off with adhesive tape(angle=180°)
  3. Calculating the area ratio of transcribed Copper oxide on adhesive tape
Test method of tape peeling

Main characteristics

  •  The ingredient has high heat-resistance than the general anti-tarnish (Benzotriazole=BTA).
  •  AT-4 has a high affinity for Copper, can form a dense monolayer.
  •  The monolayer of AT-4 can cohabit wire-bondability, solderability.
  •  Anti-CPO(Copper oxide Peeling Off) is equal to the existing anti-tarnish (PSC type).
  •  In addition the above properties, AT-4 also has moisture resistance, heat-discoloration resistance

Main uses

  •  IC lead frame
  •  Copper bonding wire
  •  Copper paste
  •  Copper-bump joint